📊Executive Summary

Hanmi Semiconductor has launched an innovative customer rewards program, offering credits equivalent to 2% of equipment order values, aimed at strengthening partnerships in the AI chip manufacturing sector. This initiative is part of Hanmi's strategy to maintain its leadership in the thermal compression bonder market, crucial for producing high-bandwidth memory (HBM) chips. The company commands a significant share of this market and is investing heavily in new technologies and facilities to meet growing demand. As the AI semiconductor market expands, Hanmi's financial incentives and technological advancements position it well for future growth, making it a key player for procurement teams to monitor....