📊Executive Summary

Malaysia has initiated a national consortium, the Malaysia Advanced Packaging Consortium (MAPC), to develop advanced semiconductor packaging capabilities within two years. This initiative, backed by approximately US$39 million, aims to transition Malaysia from its traditional role in outsourced semiconductor assembly to developing its own advanced packaging expertise. The program is expected to enhance Malaysia's technological sovereignty, generate economic opportunities, and support long-term industrial upgrading. This move is significant as it positions Malaysia as a potential regional hub for high-value chip packaging and testing, which could impact procurement strategies for companies relying on semiconductor packaging services....