📊Executive Summary

Intel and 3DGS Inc. have announced a $3.3 billion investment to establish a semiconductor substrate manufacturing facility in Odisha, India, projected to be completed over the next five to six years. This facility will focus on advanced packaging glass core substrates and high-density interconnect substrates, which are critical components in semiconductor manufacturing. The initiative is expected to create over 1,800 high-skilled jobs and aligns with the Indian government's strategy to boost domestic semiconductor production through subsidies. This development is significant for procurement teams as it indicates a growing manufacturing capacity in India, which could impact sourcing strategies and supply chain dynamics in the semiconductor sector....