📊Executive Summary

LIG Nex1 has partnered with Bose Semiconductor to develop physical AI solutions for drones and robots, focusing on high-performance system-on-chip (SoC) technologies. This collaboration aims to enhance the competitiveness of domestic AI semiconductor technology, particularly in defense and industrial applications. The initiative is expected to reduce reliance on foreign AI semiconductor suppliers and boost the local industry. The integration of on-device AI semiconductors into next-generation drones and robots is a significant step towards advancing unmanned systems in various sectors....