📊Executive Summary

The memory component market is facing significant disruptions due to the end-of-life (EOL) announcements for DDR4, coinciding with a surge in demand driven by AI applications. Major suppliers like Micron, Samsung, and SK Hynix have indicated last-time-buy (LTB) windows for DDR4, leading to tighter availability, increased lead times, and volatile pricing. As fabs shift focus towards higher-margin products like DDR5 and HBM, legacy DDR4 production is being deprioritized, resulting in shortage-like conditions. Price hikes of 15% to 30% have been reported, particularly affecting industrial and automotive sectors. OEMs and other buyers must adapt to these changes to avoid production gaps and escalating costs....