📊Executive Summary

IBM has developed a groundbreaking 2nm semiconductor manufacturing process that utilizes a 300mm silicon wafer, significantly improving performance and energy efficiency compared to existing 7nm technologies. This innovation could enhance various applications, including smartphones, laptops, and autonomous vehicles, but IBM will not manufacture consumer products directly. Instead, it plans to license this technology to chipmakers starting in 2024 or 2025. The development is expected to influence major players in the semiconductor industry, particularly TSMC and Samsung, as they expand their capabilities and look for competitive advantages. Procurement teams should monitor this advancement closely as it may impact future sourcing strategies and technology qualifications....